Metal retaining features for handheld electronic device casing

ABSTRACT

This invention is directed to mechanical and electromagnetic shielding features of an electronic device case. An electronic device case is formed of two housings, each housing having integrated snaps, channels, or other retaining features used to secure the housings together. The housings additionally include integrated retaining features used to secure electronic components within the device case. The housings and retaining features are formed of amorphous metals or other materials with high elasticities. Because the retaining features necessary to assemble the case and secure the electronic components to the case form integral parts of the housings, no external retaining features are required to assemble the electronic device in the case.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of prior filed U.S. ProvisionalPatent Application No. 61/010,078, filed Jan. 3, 2008, which isincorporated herein in its entirety.

BACKGROUND OF THE INVENTION

This invention is directed to mechanical and electromagnetic shieldingfeatures of an electronic device case.

SUMMARY OF THE INVENTION

An electronic device case is provided. In some embodiments, the caseincludes a first housing having a retaining feature extending from it.The retaining feature forms an integral part of the first housing, andis formed of an elastic material. The case further includes a secondhousing having an inner surface, the inner surface having a channelformed on it along an edge of the second housing. The retaining featureengages the channel when the electronic case is assembled, and securelycouples the first and second housings together.

In other embodiments, the electronic device case includes a housinghaving an inner surface and having a retaining feature extending fromthe inner surface. The retaining feature forms an integral part of thehousing and is formed of an elastic material. The retaining featureengages a component of the electronic device and elastically couples thecomponent to the housing.

A method for constructing an electronic device case is also provided. Insome embodiments, the method includes producing a first housing using asingle production step. The first housing is produced such that thehousing has a retaining feature that is formed as an integral part ofthe housing, and that extends from an edge of the housing. The retainingfeature is formed of an elastic material. The method further includesproducing a second housing using a single production step, the secondhousing being produced such that it has a channel formed along an edgeof an inner surface of the housing. The channel is formed such that theretaining feature engages the channel when the electronic case isassembled, and such that the first and second housings are securelycoupled together when the retaining feature engages the channel.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present invention, its nature andvarious advantages will be more apparent upon consideration of thefollowing detailed description, taken in conjunction with theaccompanying drawings, and in which:

FIG. 1A is a front view of an illustrative electronic device case inaccordance with one embodiment of the invention;

FIG. 1B is a top view of the electronic device case of FIG. 1A inaccordance with one embodiment of the invention;

FIG. 2 is a cross-sectional view of an illustrative assembled case inaccordance with one embodiment of the invention; and

FIGS. 3A-3D are oblique views of four illustrative retaining featureassemblies in accordance with various embodiments of the invention.

DETAILED DESCRIPTION

An electronic device case is provided having mechanical and materialdesign features enabling the device and device case to have a smallerform factor, reduced weight, and simplified device and assemblycharacteristics as compared to prevailing device cases. The mechanicaland material design features described herein may also enable otheradvantageous electronic device case features.

FIG. 1A is a front view of an illustrative electronic device case 100 inaccordance with one embodiment of the invention. Case 100 may includescreen 105, input mechanism 107/109, and upper housing 101. Upperhousing 101 functions as a bezel. Screen 105 may be any suitable screenor display for providing content to a user of the electronic device. Forexample, screen 105 may include a glass, plastic, composite,combinations thereof, or any other suitable material surface by whichcontent may be displayed. In some embodiments, screen 105 may include aninput mechanism for providing input to the electronic device (e.g., atouch screen). In other embodiments, screen 105 may be eliminated, ormay be replaced by one or more diodes, visual indicators, or other userfeedback devices.

Input mechanism 107/109 may include any suitable mechanism for providinginputs to the electronic device. For example, the input mechanism mayinclude a wheel 107 and one or more buttons 109 (e.g., a click-wheel).In some embodiments, input mechanisms may be incorporated in screen 105as a touch-screen input mechanism, such as that described in U.S. Pat.No. 6,323,846, which is incorporated by reference herein in itsentirety. The user interface may emulate a rotary phone or amulti-button keypad, which may be implemented on a touch screen or thecombination of a click wheel or other user input device and a screen. Amore detailed discussion of such a rotary phone interface may be found,for example, in U.S. patent application Ser. No. 11/591,752, filed Nov.1, 2006, entitled “Touch Pad with Symbols based on Mode,” which isincorporated by reference herein in its entirety.

Upper housing 101 may form the upper outer surface of case 100. Housing101 may include apertures for receiving screen 105 and input mechanism107/109, and may include features on the inner surface of housing 101for coupling each of screen 105 and input mechanism 107/109 in housing101. In some embodiments, housing 101 may include additional aperturesfor accessing connectors and input mechanisms. FIG. 1B is a top view ofthe electronic device case of FIG. 1A in accordance with one embodimentof the invention. As shown in FIG. 1B, housing 101 may include aperturesfor accessing connector 111 and jack plug 113. Case 100 may includelower housing 103, which may be coupled to housing 101 to form the outersurface of case 100.

One or both of housing 101 and housing 103 may be constructed from anysuitable material, and using any suitable approach. For example, housing101 and housing 103 may be formed from metal in order to protect theelectronic and/or other devices located inside case 100 fromelectro-magnetic interference (EMI) and electro-static discharge (ESD).Alternatively, one, both, or a portion of housing 101 and housing 103may be constructed of a non-metallic material to enable the electronicdevice located inside case 100 to emit or receive electro-magneticsignals (e.g., radio, WIFI, GSM, or other signals). Housing 101 andhousing 103 may be constructed from a material selected for its weight,strength, shielding properties, compliance or elasticity, durability,cost, aesthetics, or any suitable attribute or combination ofattributes.

FIG. 2A is a cross-sectional view of a portion of an illustrativeassembled case 200 in accordance with one embodiment of the invention.Case 200 includes upper housing 201 which is coupled to lower housing203 to form the outer surface 221 of case 200. Upper housing 201 andlower housing 203 are coupled to each other by retaining features214/215 and 217.

Retaining feature 214/215 extends outwards from the outer edge ofhousing 201, and includes flange 214 and snap 215. In some embodiments,retaining feature 214/215 may extend from housing 201 in a directionsubstantially perpendicular to (or orthogonal or transverse to) asubstantially planar portion of housing 201. In the embodiment shown inFIG. 2, for example, retaining feature 214/215 extends from housing 201in a direction substantially perpendicular to (or transverse to) thesubstantially planar portion of housing 201 on which indentation 210 andperforation 208 are formed. In other embodiments, retaining feature214/215 may extend along or parallel to an outer wall of housing 201,effectively extending the length of the outer wall. In the embodimentshown in FIG. 2, for example, retaining feature 214/215 extends alongthe outer wall of housing 201 (the outer wall being depicted as thevertical portion of housing 201 that is substantially perpendicular tothe planar portion of the housing).

Retaining feature 214/215 can come into contact with inner surface 219of housing 203 when case 200 is assembled. In a preferred embodiment,flange 214 and snap 215 form integral parts of housing 201 (i.e., theyare formed as a unit) and are formed as part of the same manufacturingprocess as housing 201. The physical contact between flange 214 andhousing 203 may create a seal (e.g., an air-tight seal, water-proofseal, electromagnetic barrier) at the interface between the flange andhousing, ensuring that particulate matter (e.g., dust, water, dirt) andelectromagnetic waves (e.g., EMI, ESD) cannot penetrate assembled case200. In some embodiments, a sealing gasket such as a rubber gasket oro-ring may be placed between flange 214 and housing 203 to create a sealat the interface(s) between the gasket, flange 214, and housing 203.

Snap 215 may extend either from flange 214 (as shown) or directly fromhousing 201 in embodiments in which flange 214 is absent (see, e.g.,FIG. 3A showing snap 331 extending outwards from housing 311). Snap 215may be designed to engage retaining feature 217. Retaining feature 217may take the form of, for example, an indentation, channel, or otherreceiving feature formed in inner surface 219 of housing 203 (as shown).In a preferred embodiment, snap 215 may form an integral part of housing201 and be formed of the same material and as part of the samemanufacturing process as housing 201. Retaining feature 217 maysimilarly form an integral part of housing 203 and be formed of the samematerial and as part of the same manufacturing process as housing 203.Snap 215 and feature 217 may be formed from any suitable material thatallows snap 215 and/or feature 217 to be elastically deformed whenhousing 201 is inserted into housing 203. In particular, snap 215 andfeature 217 may be formed of an elastic material, i.e. a material withhigh elasticity which allows snap 215 and/or feature 217 to bend ordeform without yielding when a force is applied to them, and to regaintheir shapes once the force is removed. For example, snap 215 andfeature 217 may be formed of an amorphous metal alloy having a highelasticity and an ability to bend without yielding (e.g., liquidmetal,vitreloy, metallic glasses). In embodiments in which both snap 215 andfeature 217 are made of elastic materials, snap 215 and feature 217 maybe deformed by substantially the same amount (measured as, e.g., thesame distance from the snap's or the feature's rest position, or thesame distance from their positions when the housings are coupled) whenhousing 201 is inserted into housing 203. In some embodiments, snap 215and/or feature 217 may remain deformed while housings 201 and 203 aresecured to each other. In other embodiments, snap 215 and/or feature 217may only be deformed while housing 201 is being inserted into housing203.

Retaining features 214/215 and 217 may take various forms including, forexample, the form of snaps (as shown at 215), flanges (as shown at 214)hooks, tabs, springs, stubs, perforations, indentations (as shown at217). Various combinations of retaining or receiving features formed onupper and lower housings 201 and 203 may be used to secure the housingsto each other. Retaining features may be designed to permanently securehousings 201 and 203 together, or to temporarily or reversibly securethe housings together. While case 200 is illustratively shown as beingformed of two housings 201 and 203, case 200 may be formed of greaternumbers of housings secured to each other by any number or combinationsof retaining features. Additional characteristics of retaining featuresthat may be used in accordance with the invention are shown in FIGS.3A-3D and described in the detailed description associated with thosefigures.

Electronic device case 200 can be used to secure the various electronicand other components of the electronic device housed by case 200.Components of the electronic device may be mounted on the surface ofcase 200, or may be housed inside of case 200. Input/output mechanisms207/209 may be located on portions of outer surface 221 of case 200.Input/output mechanism 209 may be mounted in indentation 210 of theouter-surface 221 of housing 201. Input/output mechanism 207 may bemounted in perforation 208 traversing the wall of housing 201.Input/output mechanisms 207/209 may be, for example, a screen,touch-screen, diode, button, scroll-wheel, connector, jack plug, or anyother appropriate input and/or output mechanism of the electronicdevice.

Other components of the electronic device, such as plate 222, circuitboard 223, memory or hard-disk 225, battery 227, may be housed withincase 200. One or more of the components housed in case 200 may besecured to one or both of upper housing 201 and lower housing 203.Components may be firmly or elastically secured to one or more of thehousings.

Components may be mounted to or secured to housings 201 or 203 using anynumber of retaining mechanisms or features. Components may be mounted orsecured using retaining features such as one or more shafts 229, springs231, hooks 233, indentations 235, or other features extending frominner-surface 219 of case 200. Components may be secured by directphysical contact with a retaining feature, such as the contact betweencircuit board 223 and spring 231, or the contact between battery 227 andhook 233. Alternatively, components can be secured through theirphysical interactions with other components, such as the interactionbetween plate 222 and circuit board 233 and input/output mechanism 207.In some embodiments, the retaining features 229/233 used to securecomponents within case 200 may extend substantially orthogonally to (orperpendicularly, or transversely) the surface of the housing they extendfrom, or orthogonally to the portion of the surface they extend from. Incase 200 shown in FIG. 2, for example, shaft 229 and hook 233 extendsubstantially perpendicularly to the surfaces of housings 201 and 203they respectively extend from.

Retaining features designed to secure components within case 200 canform integral parts of the housings they extend from, and be formed aspart of the same manufacturing process as those housings. For example incase 200, shaft 229 and spring 231 may form an integral part of housing201 and be formed as part of the same manufacturing process as housing201. Similarly, hook 233 may form an integral part of housing 203 and beformed as part of the same manufacturing process as housing 203. Inpreferred embodiments, the retaining features 229, 231, and 233 areformed of the same material as the housing they extend from. Theretaining features may in particular be formed of materials with highelasticities, such as amorphous metals, in order for the retainingfeatures to elastically deform when the components they secure areinserted into the housings.

Retaining features may be designed or shaped so as to elastically couplecomponents to the case, such that components can move if external forcesare applied to the components or to the case and can return to theiroriginal positions once the forces are removed. Such retaining featuresmay be designed or shaped so as to be compliant and to deform inresponse to forces applied to the components they secure. For example,shaft 229 and spring 231 may be compliant and deform in response toforces being applied to circuit board 223. In the embodiment of FIG. 2,the compliance of shaft 229 and spring 231 may prevent plate 222 andcircuit board 223 from deforming in response to forces applied tomechanism 207. The compliance of shaft 229 and spring 231 mayadditionally mechanically insulate plate 222, circuit board 223, and anyother components coupled to them, from vibrations or other forces (e.g.,bumps, drops, etc.) applied to housing 201 or case 200.

Retaining features may alternatively be designed so as not to becompliant. For example, battery 227 is secured to housing 203 by thenon-compliant retaining indentation 235 in inner-surface 219 of thehousing. Indentation 235 is formed by a localized thinning of the wallof housing 203 (e.g., a thinning of the housing wall from a thickness ofapproximately 0.6 mm to a thickness of approximately 0.3 mm).Indentation 235 may secure battery 227 by hindering lateral movement ofthe battery along inner surface 219 when the battery is engaged in theindentation. Indentation 235 may also serve to reduce the quantity ofmaterial used in manufacturing housing 203, reduce the weight of housing203, increase the volume contained within housing 203 and case 200, andincrease the number or size of components that can be secured withincase 200.

Components of the electronic device may include retaining featuresdesigned to facilitate the securing of the components to housings 201 or203. Components may have indentations, perforations, edges, tabs, orother features operative to engage or interact with retaining featuresof the housings to secure the components. For example, beveled edge 237of battery 227 is designed such that the elastic pressure exerted bycompliant hook 233 on beveled edge 237 keeps battery 227 securelycoupled to housing 203. Hook 233 elastically deforms when battery 227 isinserted into housing 203, and exerts a constant elastic force onbeveled edge 237 to elastically secure battery 227 to inner-surface 219of indentation 235.

FIGS. 3A-3D are oblique views of four illustrative retaining featureassemblies 301-304 in accordance with various embodiments of theinvention. Each retaining feature assembly 301-304 may be used to secureone of housings 311-314 to the corresponding housing 321-324.

FIG. 3A is an oblique view of illustrative retaining feature assembly301 used to secure housing 311 to housing 321. Housing 311 includes aretaining feature, illustratively shown as snap 331, configured toengage retaining channel 341 of housing 321 in order to secure housings311 and 321 together when the housings are assembled. A seal may beformed at the interface of housings 311 and 321 when snap 331 is engagedin channel 341. In a preferred embodiment, snap 331 forms an integralpart of housing 311 and is formed of the same material and as part ofthe same manufacturing process as housing 311. Snap 331 may be formedfrom an elastic material that allows snap 331 to be elastically deformedwhen housing 311 is assembled to housing 321.

FIG. 3B is an oblique view of illustrative retaining feature assembly302 used to secure housing 312 to housing 322. Assembly 302 issubstantially similar to assembly 301, and similarly numbered elementsof assembly 302 are formed and function in substantially similar ways ascorrespondingly numbered parts of assembly 301. Similarly to assembly301, assembly 302 includes discrete snap 332 of housing 312 configuredto engage into discrete indentation 342 of housing 322. Assembly 302additionally includes a continuous flange 352 which extends from theouter edge of housing 312 and is configured to fit into a correspondingcontinuous indentation 362 of housing 322 when housings 312 and 322 areassembled. Flange 352 and indentation 362 may form a tight seal at theirinterface when housings 312 and 322 are assembled. The seal can ensurethat neither particulate matter nor electromagnetic waves can penetratethrough the assembly of housings 321 and 322.

FIG. 3C is an oblique view of illustrative retaining feature assembly303 used to secure housing 313 to housing 323. Assembly 303 issubstantially similar to assembly 302, and similarly numbered elementsof assembly 303 are formed and function in substantially similar ways ascorrespondingly numbered elements of assembly 302. Assembly 303 differsfrom assembly 302 in that housing 313 of assembly 303 includes acontinuous snap 333 and a continuous flange 353 which extendsubstantially along the entire length of the outer edge of housing 313.Housing 323 has a continuous retaining indentation 342 which extendssubstantially along the entire length of housing 323 and is configuredto engage with snap 333. When snap 333 engages indentation 342, housings313 and 333 may be held securely to each other and a tight seal may beformed at the interface of flange 353 and indentation 362.

FIG. 3D is an oblique view of illustrative retaining feature assembly304 used to secure housing 314 to housing 324. Assembly 304 issubstantially similar to assembly 301, and similarly numbered elementsof assembly 304 are formed and function in substantially similar ways ascorrespondingly numbered part of assembly 301. Assembly 304 differs fromassembly 301 in that retaining snap 334 of assembly 304 includes aperforation 354, and housing 324 of assembly 304 includes a retainingprotrusion 344. Snap 334 and protrusion 344 can be configured to securehousings 314 and 324 to each other. When protrusion 344 is engaged inperforation 354 of snap 334, housings 314 and 324 may be securedtogether. In some embodiments, retaining feature assembly 304 mayinclude a flange (not shown in FIG. 3D) which extends from the outeredge of housing 314 and is configured to fit into a correspondingindentation (not shown in FIG. 3D) of housing 324 when housings 314 and324 are assembled. The flange and indentation of assembly 304 may besubstantially similar to, and function in a manner substantially similarto, flanges 352 and 353 and indentations 362 and 363 of FIGS. 3B and 3C.In a preferred embodiment, snap 334 forms an integral part of housing314 and may be formed as part of the same manufacturing process ashousing 314. Snap 334 may be formed from any suitable material thatallows snap 334 to be elastically deformed when housing 314 is assembledto housing 324. For example, snap 334 may be formed of an amorphousmetal alloy having a high elasticity and an ability to bend withoutyielding (e.g., liquidmetal).

The above described embodiments of the invention are presented forpurposes of illustration and not of limitation, and the presentinvention is limited only by the claims which follow.

1-25. (canceled)
 26. An electronic device comprising: a housing formedfrom an amorphous metal and having a retaining feature that isintegrally formed within the housing and extends inward from an internalsurface of the housing; and an internal component disposed within thehousing and coupled to the housing by the retaining feature, wherein theretaining feature is formed from the amorphous metal and has an abilityto bend without yielding while the internal component is being assembledwithin the housing.
 27. The electronic device of claim 26, wherein theretaining feature includes a shaft portion that extends inwards from theinternal surface of the housing, wherein the shaft portion is configuredto bend without yielding while the internal component is beingassembled.
 28. The electronic device case of claim 26, wherein theretaining feature includes a spring portion that formed at an end of theshaft portion, wherein the spring portion retains the internal componentwithin the housing.
 29. The electronic device case of claim 28, whereinthe spring portion is compliant and mechanically insulates the internalcomponent from vibrations applied to the housing.
 30. The electronicdevice case of claim 26, wherein the retaining feature includes a hookthat extends inwards from the internal surface of the housing, whereinthe shaft is configured to bend without yielding while the internalcomponent is being assembled.
 31. The electronic device case of claim26, wherein the housing includes a second retaining feature that isintegrally formed within the housing and extends inward from theinternal surface of the housing.
 32. The electronic device case of claim31, wherein the first retaining feature and the second retaining featureboth deform and bend without yielding when the internal component isbeing assembled within the housing.
 33. The electronic device of claim32, wherein the at least one of the retaining feature and the secondretaining feature remains deformed when the internal component isassembled within the housing.
 34. The electronic device case of claim26, wherein the internal component includes a battery disposed relativeto the internal surface of the housing.
 35. The electronic device caseof claim 26, wherein the internal component includes a printed circuitboard disposed relative to the internal surface of the housing.
 36. Theelectronic device case of claim 35, further comprising a second internalcomponent disposed between the printed circuit board and the internalsurface of the housing.
 37. The electronic device case of claim 26,further comprising: an indentation in a surface of the housing, whereinthe indentation engages the internal component to retain the internalcomponent.
 38. The electronic device case of claim 26, wherein thehousing shields the internal component from electromagnetic interferenceand electro-static discharges.
 39. An electronic device case comprising:a first housing having a first retaining feature comprising an amorphousmetal having an ability to bend without yielding while the first housingis being assembled to a second housing, wherein the first housingfurther comprises an internal retaining feature that is integrallyformed within the first housing and extends from an internal surface ofthe first housing; the second housing having the second retainingfeature configured engage the first retaining feature to couple thefirst and second housings together; and an internal component disposedwithin the electronic device case and coupled to the first housing bythe internal retaining feature, wherein internal retaining feature isformed from the amorphous metal and has an ability to bend withoutyielding while the internal component is being assembled within thefirst housing.
 40. The electronic device case of claim 39, wherein thefirst housing comprises a flange that extends from an outer edge of thefirst housing, and wherein the flange is operative to create a seal atthe interface between the flange and the second housing when the firstand second housings are assembled.
 41. The electronic device of claim39, wherein the coupling of the first and second housings form an outersurface of the electronic device case.
 42. The electronic device ofclaim 39, wherein the first retaining feature is configured to engagethe second retaining feature by fitting the first and second housingstogether, and wherein the first retaining feature and the secondretaining feature extend substantially along the length of the first andsecond housings.
 43. A method for constructing an electronic device, themethod comprising: forming a housing from an amorphous metal, wherein aretaining feature is integrally formed within the housing and extendsfrom an internal surface of the housing; and engaging an internalcomponent to the housing by deforming the retaining feature, wherein theretaining feature bends without yielding while the internal component isbeing assembled within the housing.
 44. The method of claim 43, whereinthe retaining feature includes a shaft formed from the amorphousmaterial and bends without yielding when the internal component is beingassembled within the housing.
 45. The method of claim 43, furthercomprising engaging the internal component to a second retaining featurethat is integrally formed within the housing, wherein the retainingfeature and the second retaining feature both deform while the internalcomponent is being assembled within the housing.